With the rapid advancement of microelectronics technology, the issue of excessive localized
heat flux in electronic devices has become increasingly prominent. This study introduces a …

This research investigates block-type heat sinks in different configurations, departing from
the conventional circular cross-section pin-type heat sinks commonly found in literature. The …

To address the growing heat dissipation requirements of high heat flux electronic devices,
this work presents experimental research on a dual synthetic jets (DSJ) liquid cooling …

With their ability to provide substantial solid-fluid interfacial areas, porous-fin microchannels
emerge as a promising solution for the thermal management of upcoming microelectronic …

This paper comprehensively examines developments in bifurcated microchannels, focusing
on their role in boosting heat transfer and fluid flow efficiency in thermal management …

Branched or tree-shaped networks of microchannels are often preferred heatsink designs for
microelectronic cooling due to their ability to offer a substantially large surface area-to …

Nowadays, micro-pin fin heat sinks (MPFHSs) have shown promising performance in
removing high heat fluxes in small dimensions and are widely used in electronic cooling …

The uneven temperature distribution resulting from thermal stresses in heat sinks is a
significant issue in modern electronic devices. This numerical investigation utilizes fluid to …

Jet impingement cooling is deemed an excellent choice for the thermal management of high‐
power electronics. However, high‐pressure drop penalties and low local heat transfer …

This study presents the design and experimentation of a manifold microchannel heat sink
with diverging channels, employing ammonia as the working fluid to evaluate its thermal …