Solders for electronics product assembly can be classified based on their melting point and
soldering temperatures. This chapter focuses on low temperature solders. It considers two …

As current technology development trend of microelectronic industry driven by portable and
wearable electronic products, adopting advanced IC fabrication process technology and a …

With the development of electronic packaging technology, the functions of mobile phones
are becoming increasingly complex and the size is becoming smaller, and the requirements …

In the application of consumer electronics, thermal fatigue reliability of solder joints have
been received considerable attention nowadays due to the increasing requirement of long …

Underfill materials were originally developed to improve the solder joint reliability of the BGA
packages under the thermal cycling when they are experiencing stresses due to the CTE …