Smart Antenna Optimization Techniques for Wireless Applications
K Suriyan, R Nagarajan, G Ghinea - Electronics, 2023 - mdpi.com
In recent years, antenna design has received a lot of attention. This is due to a surge in
interest in a variety of applications, ranging from IoT to low-frequency, long-range …
interest in a variety of applications, ranging from IoT to low-frequency, long-range …
Cost-Efficient Two-Level Modeling of Microwave Passives Using Feature-Based Surrogates and Domain Confinement
A variety of surrogate modeling techniques has been utilized in high-frequency design over
the last two decades. Yet, the curse of dimensionality still poses a serious challenge in …
the last two decades. Yet, the curse of dimensionality still poses a serious challenge in …
Fully Integrated Matching Network With Bondwire for Power Amplifier Minimization [Application Notes]
LK Ho, AWL Ng, WS Chan… - IEEE Microwave …, 2025 - ieeexplore.ieee.org
This article explores the advancement of wireless communication focusing on the
development of high-performance front-end circuits in mature 5G and beyond mobile …
development of high-performance front-end circuits in mature 5G and beyond mobile …
A Compact E-Shape Patch Antenna for 5G Millimeter Wave Applications
A small scaled rectangular patch antenna has been transformed into a novel E-shaped
design, proving invaluable in wide-ranging 5G mm wave applications such as satellite …
design, proving invaluable in wide-ranging 5G mm wave applications such as satellite …
Thermal Misfit and Diffusion Induced Stresses of Cu-Al Intermetallics in Microelectronics Wire Bonding
S Shariza, TJS Anand - Defect and Diffusion Forum, 2024 - Trans Tech Publ
The thermosonic bonding technique is a widely used method for Cu wire interconnections.
However, issues arise due to volumetric changes in intermetallic compounds (IMCs) formed …
However, issues arise due to volumetric changes in intermetallic compounds (IMCs) formed …