For the past couple of decades, a considerable amount of time and effort has been spent to
enhance the predictability of warpage of semiconductor packages encapsulated by epoxy …

The thermal mismatch between different components has been a serious issue in the
reliability of electronic products. The effect of epoxy molding compound (EMC) on the …

The 2.5 D packaging technology is a high–performance method for electronic packaging.
This study addresses the reliability issues of 2.5 D packaging during the manufacturing …

The thermomechanical properties of microelectronic packages can serve as important
indicators of reliability. Indeed, it is of great interest in dynamic warpage measurement of …

This study aims to establish an accurate prediction model using artificial neural networks
(ANNs) to effectively and efficiently predict the process-induced warpage of a flip-chip chip …

This study successfully established a strip warpage simulation model of the flip-chip process
and investigated the effects of structural design and process (molding, post-mold curing …

Packaging strip warpage in the molding process is one of the important indicators of
electronic packaging reliability evaluation. There are many factors affecting packaging strip …

In this study, the time-dependent warpage behavior caused by the viscoelastic properties of
prepreg in a printed circuit board (PCB) was analyzed by finite element method (FEM). The …

In this study, a numerical methodology to predict package warpage considering
viscoelasticity with cure-kinetics during thermal process was proposed. When a package …

The current practice of viscoelastic numerical analysis based on the assumption of constant
Poisson's ratio or constant bulk modulus–architecture-dependent modeling–is discussed in …