The ultrasmooth optical components with atomic-order surface roughness and nanometre-
level shape accuracy are in immense demand with the rapid advancement of modern optical …

Nowadays, the surface quality of the material is crucial for industry and science. With the
development of micro-electronics and optics, the demand for surface quality has become …

Ultrasonic vibration assisted grinding (UAG) is an effective processing method for hard and
brittle materials. Compared with common grinding (CG), both of grinding force and …

Knowing cutting force in rotary ultrasonic machining (RUM) can help optimizing input
variables. RUM of brittle materials has been investigated both experimentally and …

This paper proposes an analytical model for predicting grinding-induced sub-surface
damage depth in a silicon wafer. The model integrates the dislocation kinetics for crack …

In this study, a high repetition rate laser ultrasonic system is developed for noncontact
detection of silicon wafer crack. A high repetition rate pulse laser is used to generate two …

The poor quality of the micro-hole in the conventional drilling (CD) of 3D needled Cf/SiC
composites seriously limits its application in modern industry. Ultrasonic assisted drilling …

A multi-layer brazed diamond wheel was produced by combing compression molding and
vacuum brazing technology. In addition, electrolytic dressing was used to overcome the …

Bearings play an important role in the national defense industry. The demands for the ultra-
precision non-standard bearings are increasing year by year. Correspondingly, the …

Si wafers are widely used as a substrate material for fabricating ICs. The quality of ICs
depends on the quality of Si wafers. The chemo-mechanical grinding (CMG) with soft …