Solidification in metal additive manufacturing: challenges, solutions, and opportunities
The physics of alloy solidification during additive manufacturing (AM) in methods such as
laser powder bed fusion (LPBF), electron beam powder bed fusion (EPBF), and laser …
laser powder bed fusion (LPBF), electron beam powder bed fusion (EPBF), and laser …
Generality of abnormal viscosity drop on cooling of CuZr alloy melts and its structural origin
It has been widely accepted that the viscosity of alloy melts increases monotonically with
temperature decreasing after exceeding the liquidus temperature. However, a distinct …
temperature decreasing after exceeding the liquidus temperature. However, a distinct …
Dynamical and structural properties of metallic liquid and glass Zr48Cu36Ag8Al8 alloy studied by molecular dynamics simulation
The structure and dynamics of the Zr 48 Cu 36 Ag 8 Al 8 alloy were investigated by
molecular dynamics simulation method using the embedded atom method (EAM) and tight …
molecular dynamics simulation method using the embedded atom method (EAM) and tight …
Evolution of dislocation and twin structures in Ti3Al during solidification
Y Gao, T Gao, L Li, Q Xie, Q Chen, Z Tian, Y Liang… - Vacuum, 2021 - Elsevier
Dislocation and twin structures often found in many metal alloys significantly affect their
mechanical properties. However, observing the evolution processes of dislocation and twin …
mechanical properties. However, observing the evolution processes of dislocation and twin …
Study of effect of size on iron nanoparticle by molecular dynamics simulation
PH Kien, Y Khamphone… - HighTech and Innovation …, 2021 - hightechjournal.org
We use molecular dynamics simulation to study iron Nanoparticles (NPs) consisting of 4000,
5000, and 6000 atoms at temperatures of 300 and 900 K. The crystallization and …
5000, and 6000 atoms at temperatures of 300 and 900 K. The crystallization and …
Solid-state bonding behavior between surface-nanostructured Cu and Au: a molecular dynamics simulation
In recent years, solid-state bonding has attracted attention for various electronic packaging
applications as an alternative to conventional solders. Surface-nanostructured materials …
applications as an alternative to conventional solders. Surface-nanostructured materials …
Structural and mechanical characterization of sputtered CuxNi100-x thin film using molecular dynamics
Molecular dynamics (MD) simulations have been employed to simulate the deposition
process of Cu and Ni atoms on the Ni (001) substrate with the different compositions in the …
process of Cu and Ni atoms on the Ni (001) substrate with the different compositions in the …
Solid− solid phase transition of tungsten induced by high pressure: A molecular dynamics simulation
X Deng, L Lin, Y Mo, K Dong, Z Tian, W Hu - Transactions of Nonferrous …, 2020 - Elsevier
The phase transition of tungsten (W) under high pressures was investigated with molecular
dynamics simulation. The structure was characterized in terms of the pair distribution …
dynamics simulation. The structure was characterized in terms of the pair distribution …
Tensile deformation behaviours of polycrystalline Cu80Ni20 alloy: insights from molecular dynamics simulations
ABSTRACT The polycrystalline Cu80Ni20 sample was simulated by molecular dynamics
(MD) approach. This sample consists of the fcc and hcp crystals alternated with disordered …
(MD) approach. This sample consists of the fcc and hcp crystals alternated with disordered …
Effect of annealing and deposition of Cu atoms on Ni trench to interface formation and growth mechanisms of Cu coating
Molecular dynamics (MD) simulation is used to simulate the deposition and annealing
process of Cu atoms on the Ni (001) trench. The results indicate that the curvature of profile …
process of Cu atoms on the Ni (001) trench. The results indicate that the curvature of profile …