Terahertz radiation for inspection and fault detection has been of interest for the
semiconductor industry since the first generation and detection of THz signals. Until recent …

In this work, we present a study on power plane defect findings using both lock-in
thermography & OBIRCH/TIVA techniques on Intel 14 nm & Intel 10 nm products. By using …

Abstract Lock-In Thermography (LIT) is a powerful non-contact and non-destructive
investigating technique that has recently emerged in the semiconductor industry. The current …

3D Package technology integrates multiple functional components into one device to
achieve technology integration and faster time-to-market. It has become a product …

Three-dimensional (3-D) packages have become a technology integrator for multiple
functional devices into one component as a cost-effective way to enable Moore's law for …

Large scale and high density packaging of ASICs are usually achieved by FCBGA forms.
The structure and materials are more complicated in FCBGA, which would cause reliability …

This paper describes a methodology that uses ANSYS workbench as a finite element (FE)
simulator together with lock-in thermography (LIT) for accurately determining defects that are …

Lock-In Thermography (LIT) is a powerful non-contact and non-destructive technique that
can be utilized to detect high-resistance defects inside semiconductor package. Its …

Non-destructive failure analysis and defect characterization are necessary steps for
electronics components. Infrared thermography is a non-invasive, contactless technology …

In the recent years, 3D packaging has become a major enabler for heterogeneous
integration of multiple functional devices and different nodes into a single package. The …