Methods of forming printable integrated circuit devices by selective etching to suspend the devices from a handling substrate and devices formed thereby
US8877648B2 - Methods of forming printable integrated circuit devices by selective etching to
suspend the devices from a handling substrate and devices formed thereby - Google Patents …
suspend the devices from a handling substrate and devices formed thereby - Google Patents …
Methods for CMOS-MEMS integrated devices with multiple sealed cavities maintained at various pressures
M Daneman, M Lim, K Huang, I Tchertkov - US Patent 9,540,230, 2017 - Google Patents
A Microelectromechanical systems (MEMS) structure comprises a MEMS wafer. A MEMS
wafer includes a handle wafer with cavities bonded to a device wafer through a dielectric …
wafer includes a handle wafer with cavities bonded to a device wafer through a dielectric …
MEMS device and manufacturing process thereof
H Fukuda, JH Won - US Patent App. 11/650,430, 2007 - Google Patents
Correspondence Address: MEMS devices require special cavity formation and sealing
Stanley P. Fisher steps such as wafer bonding which reduce the yield and Reed Smith LLP …
Stanley P. Fisher steps such as wafer bonding which reduce the yield and Reed Smith LLP …
Planar microshells for vacuum encapsulated devices and damascene method of manufacture
EP Quevy, P Monadgemi, RT Howe - US Patent 7,923,790, 2011 - Google Patents
Low temperature, multi-layered, planar microshells for encapsulation of devices such as
MEMS and microelectronics. The microshells include a planar perforated pre-sealing layer …
MEMS and microelectronics. The microshells include a planar perforated pre-sealing layer …
Integrated MEMS devices with controlled pressure environments by means of enclosed volumes
K Huang, M Lim, SS Nasiri - US Patent 8,350,346, 2013 - Google Patents
An integrated MEMS device comprises a wafer where the wafer contains two or more
cavities of different depths. The MEMS device includes one movable structure within a first …
cavities of different depths. The MEMS device includes one movable structure within a first …
Process for a sealed mems device with a portion exposed to the environment
MJ Daneman, M Lim, J Seeger, I Tchertkov… - US Patent App. 13 …, 2013 - Google Patents
BACKGROUND 0003. Many MEMS devices, specifically those measuring or modifying
aspects of the environment outside of the device (eg pressure sensors, microphones …
aspects of the environment outside of the device (eg pressure sensors, microphones …
Sensor with electromagnetically coupled hermetic pressure reference
MG Allen - US Patent 8,025,625, 2011 - Google Patents
An electromagnetically coupled hermetic chamber includes a body defining a hermetic
chamber. A first conductive struc ture is disposed within the hermetic chamber, and a second …
chamber. A first conductive struc ture is disposed within the hermetic chamber, and a second …
Microshells with integrated getter layer
EP Quevy, P Monadgemi, RT Howe - US Patent 8,288,835, 2012 - Google Patents
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6,988,789 B2 1/2006 Silverbrook 6,991,953 B1 1/2006 Bruner et al. 7,002,436 B2 2/2006 …
6,988,789 B2 1/2006 Silverbrook 6,991,953 B1 1/2006 Bruner et al. 7,002,436 B2 2/2006 …
Electromagnetically coupled hermetic chamber
M Allen - US Patent App. 11/402,439, 2006 - Google Patents
An electromagnetically coupled hermetic chamber includes a body defining a hermetic
chamber. A first conductive structure is disposed within the hermetic chamber, and a second …
chamber. A first conductive structure is disposed within the hermetic chamber, and a second …
Microshells for multi-level vacuum cavities
P Monadgemi, RT Howe, EP Quevy - US Patent 7,659,150, 2010 - Google Patents
Microshells for encapsulation of devices such as MEMS and microelectronics. In an
embodiment, the microshells include a planar perforated pre-sealing layer, below which a …
embodiment, the microshells include a planar perforated pre-sealing layer, below which a …