During the past decades, series of lead-free solders have been developed rapidly, and are
considered as the attractive interconnection materials replacing traditional Sn-Pb solders in …

With the development of lead-free solders in electronic packaging, Sn-Cu lead-free solder
has attracted wide attention due to its excellent comprehensive performance and low cost. In …

As one of the key technologies for high performance electronic devices, composite solders
have been developed to improve the thermal and mechanical properties of soldered joints …

As one of the key technologies for high performance electronic devices, composite solders
have been recently developed to improve thermal and mechanical properties of solder …

Formation/growth behaviour, phase stability, and mechanical properties of interfacial Cu 6
Sn 5 intermetallics influenced by micro-alloying in Pb-free solder joints, are of ongoing …

Recently, research into the factors that influence the formation and growth of intermetallic
compounds (IMCs) layer in lead-free solders has piqued interest, as IMCs play an important …

The effect of Co content on the microstructure, spreadability, conductivity and corrosion
resistance of Sn-0.7 Cu (mass%, mass fraction except specified) based lead-free solder was …

In this paper, TiC x particles were prepared by an in situ process and added to an Al-Bi alloy,
and the effects of TiC x particles on the homogenization preparation and refinement …

In the present investigation a directional solidification experiment was performed in order to
examine distinct microstructures related to different slices of the solidified Sn-2 wt.% Sb alloy …

Three distinct alloy/substrate couples were considered. In order to treat the reaction interface
problem effectively, sheets of commercially pure copper (Cu), electrolytic nickel (Ni) and low …