Timing-aware fill insertions with design-rule and density constraints
Metal fill insertion has become an essential step in reducing dielectric thickness variation
and improving pattern uniformity, which is important in mitigating process variations, thereby …
and improving pattern uniformity, which is important in mitigating process variations, thereby …
A novel and unified full-chip CMP model aware dummy fill insertion framework with SQP-based optimization method
Dummy filling is widely applied to significantly improve the planarity of topographic patterns
for the chemical mechanical polishing process in VLSI manufactures. The main challenge of …
for the chemical mechanical polishing process in VLSI manufactures. The main challenge of …
NeurFill: Migrating full-chip CMP simulators to neural networks for model-based dummy filling synthesis
Dummy filling is widely applied to significantly improve the planarity of topographic patterns
for the chemical mechanical polishing (CMP) process in VLSI manufacturing. This paper …
for the chemical mechanical polishing (CMP) process in VLSI manufacturing. This paper …
pNeurFill: Enhanced Neural Network Model-Based Dummy Filling Synthesis With Perimeter Adjustment
Dummy filling is widely applied to significantly improve the planarity of topographic patterns
for the chemical mechanical polishing (CMP) process in VLSI manufacturing. In the dummy …
for the chemical mechanical polishing (CMP) process in VLSI manufacturing. In the dummy …
GAN-dummy fill: timing-aware dummy fill method using GAN
The chemical mechanical polishing (CMP) dummy fill method is commonly used for the
planarization of the CMP process, resulting in the development of many automated methods …
planarization of the CMP process, resulting in the development of many automated methods …
Towards Automated End-to-End VLSI Design for Manufacturability Solutions
B Jiang - 2021 - search.proquest.com
Pushing the integrated circuit (IC) technology node to extreme brings in daunting challenges
for the semiconductor manufacturing. The IC fabrication involves a series of physical and …
for the semiconductor manufacturing. The IC fabrication involves a series of physical and …