Investigation on anchor and base design for aluminum nitride flexural mode resonators
Y Yuan, Q Yang, H Li, S Shi, P Niu, C Sun… - Journal of …, 2023 - iopscience.iop.org
This paper investigates the impact of base and anchor on the quality factor (Q) of
piezoelectric microelectromechanical system (MEMS) tuning fork resonators vibrating in in …
piezoelectric microelectromechanical system (MEMS) tuning fork resonators vibrating in in …
Via technologies for MEMS
P Dixit, K Henttinen - Handbook of silicon based MEMS materials and …, 2015 - Elsevier
Wafer-level three-dimensional (3D) integration is an emerging interconnection technique in
which multiple layers of electronic devices are fabricated on individual wafers and then …
which multiple layers of electronic devices are fabricated on individual wafers and then …
Electrode design for multimode suppression of aluminum nitride tuning fork resonators
Y Yuan, Q Yang, H Li, S Shi, P Niu, C Sun… - Nanotechnology and …, 2023 - pubs.aip.org
This paper is focused on electrode design for piezoelectric tuning fork resonators. The
relationship between the performance and electrode pattern of aluminum nitride …
relationship between the performance and electrode pattern of aluminum nitride …
Through-substrate vias based three-dimensional interconnection technology
P Dixit, HK Kannojia, K Henttinen - … of Silicon Based MEMS Materials and …, 2020 - Elsevier
An overview of the through-substrate vias (TSVs), the associated fabrication techniques and
their applications in MEMS and electronic packaging have been presented in this chapter …
their applications in MEMS and electronic packaging have been presented in this chapter …