Review on polymer composites with high thermal conductivity and low dielectric properties for electronic packaging
Polymers are widely used in electronic packaging due to their easy processing, lightweight,
excellent insulation, and good mechanical properties. However, as electronic devices …
excellent insulation, and good mechanical properties. However, as electronic devices …
A review of system-in-package technologies: application and reliability of advanced packaging
H Wang, J Ma, Y Yang, M Gong, Q Wang - Micromachines, 2023 - mdpi.com
The system-in-package (SiP) has gained much interest in the current rapid development of
integrated circuits (ICs) due to its advantages of integration, shrinking, and high density. This …
integrated circuits (ICs) due to its advantages of integration, shrinking, and high density. This …
High thermal conductivity and low dielectric polyimide nanocomposites using diamine-assisted mechanochemical exfoliation boron nitride and in-situ polymerization …
Z Peng, Q Guo, L Zhang, C Li - Chemical Engineering Journal, 2024 - Elsevier
Advanced integrated circuit materials demand polymer composites with exceptional thermal
conductivity and low dielectric constant to minimize power consumption and improve signal …
conductivity and low dielectric constant to minimize power consumption and improve signal …
Study of a 3D FSS-Based Printed Radome Demonstrator for a Patch Antenna at 3.6 GHz
TH Le Dam, A Niembro-Martin… - 2022 52nd …, 2022 - ieeexplore.ieee.org
We present an FSS-based printed radome demonstrator which is used to orientate a patch
antenna radiation pattern in 5G applications. The FSS-based pattern is printed onto a plastic …
antenna radiation pattern in 5G applications. The FSS-based pattern is printed onto a plastic …
Printed radome for reconfigurable antenna radiation pattern in 5G applications
C Delfaut, G Houzet, T Lacrevaz… - … on Antennas and …, 2021 - ieeexplore.ieee.org
This paper presents an innovative radome in order to customize antennas radiation pattern
for 5G applications. For that, a 3D direct writing process is used to print patterns onto a half …
for 5G applications. For that, a 3D direct writing process is used to print patterns onto a half …
Switchable FSS-based 3D Printed Radome using Diodes at 3.6 GHz
TH Le Dam, A Niembro-Martin… - 2023 53rd European …, 2023 - ieeexplore.ieee.org
We present a switchable FSS-based printed radome using pin diodes that allows controlling
the radiation pattern of a patch antenna at 3.6 GHz. The jetting technology is employed to …
the radiation pattern of a patch antenna at 3.6 GHz. The jetting technology is employed to …
Exploring PLA/Flax Substrates for Antenna Applications: Assessing Moisture, Temperature and Dielectric Constant Homogeneity
V Grennerat, GZ El Nashef, A Sabra… - 2024 18th European …, 2024 - ieeexplore.ieee.org
This paper investigates the potential of polylactic acid (PLA)/Flax substrates as eco-friendly
alternatives for radio frequency (RF) antenna applications in the context of sustainability …
alternatives for radio frequency (RF) antenna applications in the context of sustainability …
Intégration de fonctions électroniques imprimées sur des thermoplastiques 2D et 3D pour des applications radiofréquences
C Delfaut - 2022 - theses.hal.science
La chaire MINT (innovating for molded & printed electronics) est une Chaire d'Excellence
scientifique soutenue par la Fondation Partenariale Grenoble INP et ayant pour mécène …
scientifique soutenue par la Fondation Partenariale Grenoble INP et ayant pour mécène …