3D-ICE: A compact thermal model for early-stage design of liquid-cooled ICs
Liquid-cooling using microchannel heat sinks etched on silicon dies is seen as a promising
solution to the rising heat fluxes in two-dimensional and stacked three-dimensional …
solution to the rising heat fluxes in two-dimensional and stacked three-dimensional …
Greencool: An energy-efficient liquid cooling design technique for 3-d mpsocs via channel width modulation
Liquid cooling using interlayer microchannels has appeared as a viable and scalable
packaging technology for 3-D multiprocessor system-on-chips (MPSoCs). Microchannel …
packaging technology for 3-D multiprocessor system-on-chips (MPSoCs). Microchannel …
Data convection: A gpu-driven case study for thermal-aware data placement in 3d drams
Stacked DRAMs have been studied, evaluated in multiple scenarios, and even productized
in the last decade. The large available bandwidth they offer make them an attractive choice …
in the last decade. The large available bandwidth they offer make them an attractive choice …
The mango fet-hpc project: An overview
In this paper, we provide an overview of the MANGO project and its goal. The MANGO
project aims at addressing power, performance and predictability (the PPP space) in future …
project aims at addressing power, performance and predictability (the PPP space) in future …
Material selection for heat sinks in HPC microchip-based circuitries
KJ Akinluwade, FO Omole… - British Journal of …, 2015 - info.submit4journal.com
Heat sinks are integral components of high-powered computing system (HPC) microchips
which are extensively used in modern electronics and power supply circuitries with …
which are extensively used in modern electronics and power supply circuitries with …
Enabling HPC for QoS-sensitive applications: The MANGO approach
In this paper, we provide an overview of the MANGO project and its goal. The MANGO
project aims at addressing power, performance and predictability (the PPP space) in future …
project aims at addressing power, performance and predictability (the PPP space) in future …
Heterogeneous memory management for 3D-DRAM and external DRAM with QoS
LN Tran, FJ Kurdahi, AM Eltawil… - 2013 18th Asia and …, 2013 - ieeexplore.ieee.org
This paper presents an innovative memory management approach to utilize both 3D-DRAM
and external DRAM (ex-DRAM). Our approach dynamically allocates and relocates memory …
and external DRAM (ex-DRAM). Our approach dynamically allocates and relocates memory …
End-to-end analysis of integration for thermocouple-based sensors into 3-D ICs
D Li, S Joshi, JH Kim… - IEEE Transactions on …, 2017 - ieeexplore.ieee.org
Solutions to the integration challenges of a new thermal sensor technology into 3-D
integrated circuits (ICs) will be discussed in this paper. Our proposed architecture uses …
integrated circuits (ICs) will be discussed in this paper. Our proposed architecture uses …
A combined sensor placement and convex optimization approach for thermal management in 3D-MPSoC with liquid cooling
Modern high-performance processors employ thermal management systems, which rely on
accurate readings of on-die thermal sensors. Systematic tools for analysis and determination …
accurate readings of on-die thermal sensors. Systematic tools for analysis and determination …
Cooling architectures using thermal sidewalls, interchip plates, and bottom plate for 3D ICs
K Furumi, M Imai, A Kurokawa - 2017 18th International …, 2017 - ieeexplore.ieee.org
Thermal management for three-dimensional integrated circuits (3D ICs) is becoming a
crucial challenge. In this paper, we propose new cooling architectures using thermal …
crucial challenge. In this paper, we propose new cooling architectures using thermal …