Modern computer microprocessor chips are marvels of engineering complexity. For the
current 45 nm technology node, there may be nearly a billion transistors on a chip barely 1 …

The ever increasing requirements for electrical performance of on-chip wiring has driven
three major technological advances in recent years. First, copper has replaced Aluminum as …

The introduction of ultra low-k materials in copper technology has been much slower than
anticipated in the ITRS Roadmap. The introduction of porosity in low-k materials has …

The short-ranged bonding structure of organosilicate glasses can vary to a great extent and
is directly linked to the mechanical properties of the thin film material. The combined action …

The increasing sensitivity of porous low dielectric constant materials to process damage
constitutes a major roadblock to their implementation in back-end-of-the-line (BEOL) wiring …

This work proposes a fundamental understanding of structural transformation occurring
during porogen extraction from as-deposited ultralow k (ULK) materials when exposed to …

The removal of an oxygen-containing plasma-modified layer on top of porous low dielectric
constant (low-k) materials by treatment with aqueous HF has been investigated. Our study …

Ultraviolet (UV)-assisted cure has recently been reported as an efficient method to enhance
the mechanical properties of organosilicate glasses (OSG) at the expense of only minor film …

The thermomechanical stability of a system composed of a metallic cap layer on top of a low-
k thermosetting polymer film is investigated. It is observed that, when metal layers with high …

Postdeposition chemical etching of spectral-hole filters, which were fabricated as chiral
sculptured thin films with central 90-deg-twist defects, decreases the cross-sectional …