A Small and highly reliable acoustic wave device and a method for production of the same
will be provided. The acoustic wave device has a piezoelectric substrate 1; a SAW element 2 …

(57) ABSTRACT A flip chip semiconductor packaging device and method that incorporates
in situ formation of cavities underneath selected portions of a die during a flip chip die …

A method for manufacturing a composite piezoelectric substrate in which a piezoelectric
substrate and a supporting substrate are prepared, ions are implanted in the piezoelectric …

A piezoelectric substrate is joined to a cover with a support layer disposed therebetween
and with a space maintained therebetween. A transmission surface acoustic wave filter and …

Substrate including an interdigital transducer located on one principal Surface thereof, an
insulating layer arranged around the interdigital transducer, a cover layer arranged over the …

In order to overcome the problems described above, preferred embodiments of the present
invention provide a piezoelectric device capable of improving moisture resis tance While …

The present invention is directed to a process for packaging a microelectrical,
micromechanical, microelectromechani cal (MEMS) or microfluidic component on a …

A flip chip packaged component includes a die having a first surface and a dielectric barrier
disposed on the first surface of the die. The dielectric barrier at least partially surrounds a …

A SAW device (1) has a substrate (3) configured to propagate acoustic waves; an IDT
electrode (15) on a first main surface (3 a) of a substrate (3); and an electrode pad (13) on …

The present invention provides a Surface mountable pack age for use with an MEMS
transducer, the MEMS transducer being a MEMS microphone transducer, a MEMS speaker …