This new edition of the bestselling Microlithography: Science and Technology provides a
balanced treatment of theoretical and operational considerations, from elementary concepts …

ABSTRACT A nonintrusive, in situ technique is presented for measuring film thickness
profiles during spin coating. Stroboscopic interferograms are created using a pulsed laser …

A model for predicting film thickness profiles around topographical features during spin
coating is presented. This model is applicable to features of arbitrary geometry in the two …

The parallel electromagnetic simulation program TEMPEST has been generalized to
analyze three-dimensional problems in photolithography. TEMPEST, which has been made …

In the recent past, scaling of semiconductor fabrication systems has been dominated by
wavelength and numerical aperture modifications. This is now no longer the case for 193 …

It is argued that the cost of manufacturing submicron, ultra-large-scale integration (ULSI)
integrated circuits (ICs)(which is scaling upward at least in inverse proportion to the …

This thesis describes the latest embodiment of a three-dimensional electromagnetic
simulation program called TEMPEST which is implemented on the connection machines CM …

A novel massively parallel technique for rigorous simulation of topography scattering in
optical lithography has been developed and tested. The method is equivalent to the time …

Optical measurement of image shortening on a lithographi cally formed minimum feature is
enhanced using crossed polarizer imaging. The minimum feature, Which is com prised of a …

Results of recent Investigations uncovering significant errors in overlay (O/L) measurements
are reported. The two major contributors are related to the failures of symmetry of the overlay …