This review investigates the measurement methods employed to assess the geometry and
electrical properties of through-silicon vias (TSVs) and examines the reliability issues …

To meet the requirements of low cost, thin vehicles, and multiple functions, the fan-out panel-
level packaging (FO-PLP) is introduced to be one of the next-generation packaging …

Aiming at the problems of multi-scale mesh division and low computational efficiency
encountered during TXV (through X via) structural simulation, an equivalent modeling …

The application of patch methods for repairing abdominal wall wounds presents a variety of
challenges, such as adhesion and limited mobility due to inadequate mechanical strength …

A three-dimensional integrated circuit (3D-IC) structure with a significant scale mismatch
causes difficulty in analytic model construction. This paper proposes a simulation technique …

To meet the requirements of achieving high density and heterogeneous integrations, fan-out
Panel level packaging (FOPLP) technology regarded as one of the promising alternative …

2.5 D package realizes the interconnection of multiple dies through Si interposers, which
can greatly improve the data transmission rate between dies. However, its multi-layer …

A huge shift in classical system integration composed of heterogeneous and homogeneous
substances from 2D to 2.5 D or even 3D assembly is a promising solution to satisfying the …

The polystyrene/TiO 2 nanocomposite coating is evaluated for reducing the susceptibility of
aluminum alloy AA2024-T3 to stress corrosion cracking (SCC). The as-synthesized titania …

Packaging technology is a major challenge to tapping the performance potential of wide
bandgap devices. This paper proposes a packaging design based on the printed circuit …