Recent progress of Sn–Ag–Cu lead-free solders bearing alloy elements and nanoparticles in electronic packaging
J Wu, S Xue, J Wang, S Liu, Y Han, L Wang - Journal of Materials Science …, 2016 - Springer
Abstract Sn–Ag–Cu lead-free solders, containing alloy elements and nanoparticles, have
been extensively investigated. With the extensive prevalence of 3D IC package, a major …
been extensively investigated. With the extensive prevalence of 3D IC package, a major …
Development of new multicomponent Sn–Ag–Cu–Bi lead-free solders for low-cost commercial electronic assembly
AA El-Daly, AM El-Taher, S Gouda - Journal of Alloys and Compounds, 2015 - Elsevier
Abstract Eutectic Sn–Ag–Cu (SAC) solder is one of the candidate alternatives to Sn–Pb-
based solder alloys. The coupling effect of both minor alloying Bi addition and reducing the …
based solder alloys. The coupling effect of both minor alloying Bi addition and reducing the …
Effects of minor Bi, Ni on the wetting properties, microstructures, and shear properties of Sn–0.7 Cu lead-free solder joints
J Shen, Y Pu, D Wu, Q Tang, M Zhao - Journal of Materials Science …, 2015 - Springer
In present study, minor addition of Bi and Ni were added with Sn–0.7 Cu eutectic solder to
investigate the effect of exotic elements on the wetting properties, microstructures as well as …
investigate the effect of exotic elements on the wetting properties, microstructures as well as …
Enhancing the microstructure and tensile creep resistance of Sn-3.0 Ag-0.5 Cu solder alloy by reinforcing nano-sized ZnO particles
AE Hammad, AA Ibrahiem - Microelectronics Reliability, 2017 - Elsevier
Abstract Sn-Ag-Cu lead-free solders are regarded as a potential substitute for Pb-Sn solder
alloys. In the current study, the non-reacting, non-coarsening ZnO nano-particles (ZnO NPs) …
alloys. In the current study, the non-reacting, non-coarsening ZnO nano-particles (ZnO NPs) …
Achieving microstructure refinement and superior mechanical performance of Sn-2.0 Ag-0.5 Cu-2.0 Zn (SACZ) solder alloy with rotary magnetic field
AE Hammad, M Ragab - Microelectronics Reliability, 2020 - Elsevier
The investigation of a prospective lead-free solder alloy provides the essential data for
microelectronic applications and estimation of solder joint reliability. In this study, we used …
microelectronic applications and estimation of solder joint reliability. In this study, we used …
Novel low Ag-content Sn–Ag–Cu–Sb–Al solder alloys with enhanced elastic compliance and plastic energy dissipation ability by applying rotating magnetic field
AM El-Taher, SE Abd El Azeem… - Journal of Materials …, 2021 - Springer
The main scope of this research is to investigate the impact of rotating magnetic field (RMF)
on the physical properties of the Sn–0.5 Ag–0.5 Cu–2.0 Sb–0.1 Al (SAC0505SbAl) solder …
on the physical properties of the Sn–0.5 Ag–0.5 Cu–2.0 Sb–0.1 Al (SAC0505SbAl) solder …
[PDF][PDF] Investigating the microstructural and mechanical properties of pure lead-free soldering materials (SAC305 & SAC405)
Abstract The Sn–Ag–Cu (SAC) solders with low Ag or Cu content have been identified as
promising candidates to replace the traditional Sn–Pb solder. In this study, an extensive …
promising candidates to replace the traditional Sn–Pb solder. In this study, an extensive …
Study on hardness and shear strength with microstructure properties of Sn52Bi/Cu+ 1% Al2O3 nanoparticles
A Singh, R Durairaj - IOP Conference Series: Materials Science …, 2020 - iopscience.iop.org
Abstract The Sn-58Bi (SB) lead-free solder was added with 1% nanoparticles (NP) of
aluminium oxide (Al 2 O 3) to investigate the shear strength based on microstructure and …
aluminium oxide (Al 2 O 3) to investigate the shear strength based on microstructure and …
Advancement solidification microstructure and mechanical properties of Sn–2.0 Ag–0.5 Cu alloy by applying a rotary magnetic field
AE Hammad, M Ragab - Journal of Materials Science: Materials in …, 2019 - Springer
In the present study, for the first time, rotating magnetic field (RMF) was used to improve the
solidification microstructure and mechanical properties of Sn–2.0 Ag–0.5 Cu (SAC205) …
solidification microstructure and mechanical properties of Sn–2.0 Ag–0.5 Cu (SAC205) …
Influences of rotating magnetic field on microstructure and properties of Sn–Ag–Cu–Sb–Ce solder alloy
Z Wang, F Liu, J Liu, J Zhou, Z Wang, N Yan - Journal of Materials Science …, 2023 - Springer
The effect of the rotating magnetic field (RMF) on the microstructure and properties of Sn-1.0
Ag-0.5 Cu-0.5 Sb-0.07 Ce alloy was investigated. The phase composition of the solder was …
Ag-0.5 Cu-0.5 Sb-0.07 Ce alloy was investigated. The phase composition of the solder was …