An analytical fringe capacitance model for interconnects using conformal mapping

A Bansal, BC Paul, K Roy - IEEE Transactions on Computer …, 2006 - ieeexplore.ieee.org
An analytical model is proposed to compute the fringe capacitance between two
nonoverlapping interconnects in different layers using a conformal mapping technique. With …

[图书][B] Advanced field-solver techniques for RC extraction of integrated circuits

W Yu, X Wang - 2014 - Springer
The main goal of writing this book was to present a methodological and algorithmic
perspective on the field-solver-based parasitic extraction of integrated circuits (ICs) …

VoxCap: FFT-accelerated and Tucker-enhanced capacitance extraction simulator for voxelized structures

M Wang, C Qian, JK White… - IEEE Transactions on …, 2020 - ieeexplore.ieee.org
VoxCap, a fast Fourier transform (FFT)-accelerated and Tucker-enhanced integral equation
simulator for capacitance extraction of voxelized structures, is proposed. The VoxCap solves …

Fast capacitance extraction of actual 3-D VLSI interconnects using quasi-multiple medium accelerated BEM

W Yu, Z Wang, J Gu - IEEE Transactions on Microwave Theory …, 2003 - ieeexplore.ieee.org
A quasi-multiple medium (QMM) method based on the direct boundary element method
(BEM) is presented to extract the capacitance of three-dimensional (3-D) very large scale …

Hierarchical block boundary-element method (HBBEM): a fast field solver for 3-D capacitance extraction

T Lu, Z Wang, W Yu - IEEE Transactions on Microwave Theory …, 2004 - ieeexplore.ieee.org
As feature size decrease, fast and accurate parasitic capacitance extraction has become
increasingly critical for verification and analysis in very large scale integration design. In this …

[PDF][PDF] Capacitance extraction

W Yu, Z Wang - Encyclopedia of RF and microwave engineering, 2005 - researchgate.net
Since the early 1950s, microwave circuits have evolved from discrete circuits to planar
integrated circuits, then to multilayered and three-dimensional integrated circuits. With the …

[PDF][PDF] 三维VLSI 互连寄生电容提取的研究进展

喻文健, 王泽毅 - 计算机辅助设计与图形学学报, 2003 - numbda.cs.tsinghua.edu.cn
摘要随着VLSI 电路集成密度急剧增长及特征尺寸不断缩小, 互连寄生参数提取已成为集成电路
辅助设计中的一个研究热点. 目前, 三维互连寄生电容提取的研究得到广泛关注 …

A novel algorithm based on the domain-decomposition method for the full-wave analysis of 3-D electromagnetic problems

L Yin, J Wang, W Hong - IEEE transactions on microwave …, 2002 - ieeexplore.ieee.org
A novel technique based on the domain-decomposition method and frequency-domain finite-
difference method is presented for the full-wave analysis of three-dimensional …

A finite‐difference‐based technique for numerically efficient computation of capacitance matrices for 2‐dimensional multi‐conductor problems involving thin dielectric …

K Sharma, R Mittra - International Journal of Numerical …, 2024 - Wiley Online Library
Numerical computation of capacitance matrices using conventional finite‐difference (FD)
technique for arbitrarily shaped multi‐conductor problems which typically involve thin …

A Generalized Scalar Potential Integral Equation Formulation for the DC Analysis of Conductors

S Sharma, P Triverio - IEEE Transactions on Antennas and …, 2023 - ieeexplore.ieee.org
The electrostatic modeling of conductors is a fundamental challenge in various applications,
including the prediction of parasitic effects in electrical interconnects, the design of biasing …