[HTML][HTML] The big chip: Challenge, model and architecture

Y Han, H Xu, M Lu, H Wang, J Huang, Y Wang… - Fundamental …, 2024 - Elsevier
Abstract As Moore's Law comes to an end, the implementation of high-performance chips
through transistor scaling has become increasingly challenging. To improve performance …

Architecture of computing system based on chiplet

G Shan, Y Zheng, C Xing, D Chen, G Li, Y Yang - Micromachines, 2022 - mdpi.com
Computing systems are widely used in medical diagnosis, climate prediction, autonomous
vehicles, etc. As the key part of electronics, the performance of computing systems is crucial …

[HTML][HTML] A Sentinel-1 backscatter datacube for global land monitoring applications

W Wagner, B Bauer-Marschallinger, C Navacchi… - Remote Sensing, 2021 - mdpi.com
The Sentinel-1 Synthetic Aperture Radar (SAR) satellites allow global monitoring of the
Earth's land surface with unprecedented spatio-temporal coverage. Yet, implementing large …

InFO_oS (integrated fan-out on substrate) technology for advanced chiplet integration

YP Chiang, SP Tai, WC Wu, J Yeh… - 2021 IEEE 71st …, 2021 - ieeexplore.ieee.org
The continuous pursuit of higher compute power with insatiable data bandwidth to meet
relentless AI system demands from cloud computing, data centers, enterprise servers …

Finite element modeling and analysis method for predicting and optimizing the warpage of construction before flip chip bonding in System-on-Wafer process flow

Y Duan, G Liu, W Wang, Q Deng, J Li, R Cao… - Microelectronics …, 2023 - Elsevier
As one of the solutions to surpass the limitations of Moore's Law in the post-Moore era,
System-on-Wafer (SoW) technology provides the capability to integrate multiple chip …

Wafer-Scale Computing: Advancements, Challenges, and Future Perspectives [Feature]

Y Hu, X Lin, H Wang, Z He, X Yu… - IEEE Circuits and …, 2024 - ieeexplore.ieee.org
Nowadays, artificial intelligence (AI) technology with large models plays an increasingly
important role in both academia and industry. It also brings a rapidly increasing demand for …

Waferscale network switches

S Chen, S Pal, R Kumar - 2024 ACM/IEEE 51st Annual …, 2024 - ieeexplore.ieee.org
In spite of being a key determinant of latency, cost, power, space, and capability of modern
computer systems, network switch radix has not seen much growth over the years due to …

A Wafer-Scale heterogeneous integration thermal simulator

Q Xu, C Wang, Z Li, D Zhang, X Ma, H Cao… - Applied Thermal …, 2025 - Elsevier
The resurgence of wafer-scale heterogeneous integration necessitates efficient simulation
methodologies to enable thermal-aware design space exploration, particularly for iteration …

Switch-Less Dragonfly on Wafers: A Scalable Interconnection Architecture based on Wafer-Scale Integration

Y Feng, K Ma - SC24: International Conference for High …, 2024 - ieeexplore.ieee.org
Existing high-performance computing (HPC) interconnection architectures are based on
high-radix switches, which limits the injection/local performance and introduces …

State-of-the-art of advanced packaging

JH Lau - Chiplet Design and Heterogeneous Integration …, 2023 - Springer
In this chapter, advanced packaging is defined. The kinds of advanced packaging are
ranked based on their interconnect density and electrical performance, and are grouped into …