A review on cutting of industrial ceramic materials

R Rakshit, AK Das - Precision Engineering, 2019 - Elsevier
Ceramics have garnered huge engineering applications in various manufacturing industries.
This is due to their excellent mechanical properties at high temperature, good oxidation …

Modelling and experimental investigations of microcracks in crystalline silicon photovoltaics: A review

L Papargyri, M Theristis, B Kubicek, T Krametz… - Renewable Energy, 2020 - Elsevier
In recent years, the scientific research into photovoltaic (PV) technology has focused on the
failure modes in order to increase the PV reliability, durability and service lifetime. One of the …

Progress in recovery and recycling of kerf loss silicon waste in photovoltaic industry

J Li, Y Lin, F Wang, J Shi, J Sun, B Ban, G Liu… - Separation and …, 2021 - Elsevier
With the rapid growth of the photovoltaic (PV) industry, the amount of the silicon waste has
substantially increased, resulting in serious environmental problems. This waste mainly …

A comprehensive review of diamond wire sawing process for single-crystal hard and brittle materials

EM Sefene, CCA Chen, YH Tsai - Journal of Manufacturing Processes, 2024 - Elsevier
Diamond wire sawing (DWS) is the primary stage in the semiconductor industry for slicing
hard and brittle materials, delivering high surface quality with minimum kerf losses. Despite …

Effect of cutting parameters on surface integrity of monocrystalline silicon sawn with an endless diamond wire saw

EC Costa, FA Xavier, R Knoblauch, C Binder… - Solar Energy, 2020 - Elsevier
The cutting of silicon wafers using multi-diamond wire sawing is a critical stage in solar cell
manufacturing due to brittleness of silicon. Improving the cutting process output requires an …

Influence of single diamond wire sawing of photovoltaic monocrystalline silicon on the feed force, surface roughness and micro-crack depth

EC Costa, WL Weingaertner, FA Xavier - Materials science in …, 2022 - Elsevier
To gain an in-depth understanding of the influence of diamond wire sawing of
monocrystalline silicon on the feed force and wafer quality, experiments with a single …

Internal modified structure of silicon carbide prepared by ultrafast laser for wafer slicing

Y Zhang, X Xie, Y Huang, W Hu, J Long - Ceramics International, 2023 - Elsevier
Abstract Silicon Carbide (SiC) is an important substrate material for electronic components
due to its excellent properties. Compared with wire sawing technology, laser slicing …

Mechanisms of material removal and subsurface damage in fixed-abrasive diamond wire slicing of single-crystalline silicon

T Suzuki, Y Nishino, J Yan - Precision Engineering, 2017 - Elsevier
Single-crystal silicon was sliced using a newly developed high-speed fixed-abrasive dicing
wire saw. The effects of diamond grit size, wire speed, and number of slicing cycle on the …

Kinetic mechanism of aluminum removal from diamond wire saw powder in HCl solution

S Yang, K Wei, W Ma, K Xie, J Wu, Y Lei - Journal of hazardous materials, 2019 - Elsevier
Impurity removal is essential for the recovery and regeneration of silicon resources from
diamond wire saw powder by metallurgical purification technologies. In this paper, the …

High-yield synthesis of ultrathin silicon nanosheets by physical grinding enables robust lithium-ion storage

J Lu, Y Zhang, X Gong, L Li, S Pang, G Qian… - Chemical Engineering …, 2022 - Elsevier
Abstract Ultra-thin two-dimensional (2D) silicon nanosheets (SiNSs) have potential
applications in electronic, energy storage, and energy conversion devices owing to their …