For several decades, chemical mechanical polishing (CMP) has been the most widely used
planarization method in integrated circuits manufacturing. The final polishing results are …

Nanotechnology has received a considerable amount of attention from various fields and
has become a multidisciplinary subject, where several research ventures have taken place …

Computer adaptive testing (CAT) is theoretically sound and efficient, and is commonly seen
in larger testing programs. It is, however, rarely seen in a smaller-scale scenario, such as in …

Endpoint detection is an important technology in chemical mechanical polishing (CMP),
which is used to capture the material interface and compensate the variations of …

Online monitoring of complex processes, such as semiconductor manufacturing processes,
often requires the need to analyze sensor data with multiple characteristics. Some of these …

A signal processing method for the friction-based endpoint detection system of a chemical
mechanical polishing (CMP) process is presented. The signal process method uses the …

In the copper (Cu) chemical mechanical planarization (CMP) process, accurate
determination of a process reaching the end point is of great importance. Based on the eddy …

In the integrated circuit (IC) manufacturing, in-situ end-point detection (EPD) is an important
issue in the chemical mechanical planarization (CMP) process. In the paper, we chose the …

Advancements made in sensor technology have resulted in complex sensor data that
captures multiple process events. Real-time monitoring of complex manufacturing …

The semiconductor manufacturing is one of the most sophisticated processes in modern
industries. It contains hundreds of complex operations, and this makes semiconductor …