Review of jet impingement cooling of electronic devices: Emerging role of surface engineering
The rising requirements of computing capability with an ever-declining packaging volume
has triggered a global surge in the thermal management industry of electronic devices over …
has triggered a global surge in the thermal management industry of electronic devices over …
The development and progress of multi-physics simulation design for TSV-based 3D integrated system
In order to meet the requirements of high performance, miniaturization, low cost, low power
consumption and multi-function, three-dimensional (3D) integrated technology has gradually …
consumption and multi-function, three-dimensional (3D) integrated technology has gradually …
System and method for across-chip thermal and power management in stacked IC designs
C Fu, WW Shen, PH Huang, MF You, CY Yu - US Patent 8,701,073, 2014 - Google Patents
BACKGROUND Integrated circuits (“ICs') are incorporated into many elec tronic devices. IC
packaging has evolved, such that multiple ICs may be vertically stacked in so-called three …
packaging has evolved, such that multiple ICs may be vertically stacked in so-called three …
Thermal and signal integrity co-design and verification of embedded cooling structure with thermal transmission line for high bandwidth memory module
In this article, we propose an embedded cooling structure with thermal transmission line
(ECS-TTL) to improve thermal integrity (TI) and signal integrity (SI) of a high-bandwidth …
(ECS-TTL) to improve thermal integrity (TI) and signal integrity (SI) of a high-bandwidth …
Assembling 2D blocks into 3D chips
Three-dimensional ICs promise to significantly extend the scale of system integration and
facilitate new-generation electronics. However, progress in commercial 3D ICs has been …
facilitate new-generation electronics. However, progress in commercial 3D ICs has been …
Enhanced thermal characterization method of microscale heatsink structures
In the frame of thermal management of electronic devices, finding efficient cooling solutions
for next generation equipment is an emerging topic. If a new or improved solution is …
for next generation equipment is an emerging topic. If a new or improved solution is …
Low-cost non-TSV based 3D packaging using glass panel embedding (GPE) for power-efficient, high-bandwidth heterogeneous integration
S Ravichandran, S Yamada, F Liu… - 2019 IEEE 69th …, 2019 - ieeexplore.ieee.org
This paper demonstrates a next-generation non-TSV 3D packaging architecture with small
form-factors, excellent electrical performance and reliability at low cost for high-bandwidth …
form-factors, excellent electrical performance and reliability at low cost for high-bandwidth …
Thermal power plane for integrated circuits
H Barowski, T Brunschwiler, H Harrer, A Huber… - US Patent …, 2013 - Google Patents
A mechanism is provided for a thermal power plane that delivers power and constitutes
minimal thermal resistance. The mechanism comprises a processor layer coupled, via a first …
minimal thermal resistance. The mechanism comprises a processor layer coupled, via a first …
End-to-end analysis of integration for thermocouple-based sensors into 3-D ICs
D Li, S Joshi, JH Kim… - IEEE Transactions on …, 2017 - ieeexplore.ieee.org
Solutions to the integration challenges of a new thermal sensor technology into 3-D
integrated circuits (ICs) will be discussed in this paper. Our proposed architecture uses …
integrated circuits (ICs) will be discussed in this paper. Our proposed architecture uses …
Numerical investigation of heat transfer enhancement in heat sinks using multiple rows vortex generators
This study investigates the application of multiple rows vortex generators for heat transfer
improvement of heat sinks. At first, five different geometries of heat sinks are investigated …
improvement of heat sinks. At first, five different geometries of heat sinks are investigated …