The characterization of lead-free solders, especially after isothermal aging, is very important
in order to accurately predict the reliability of solder joints. However, due to lack of …

Interconnect formation is critical for the assembly and integration of nanocomponents to
enable nanoelectronics‐and nanosystems‐related applications. Recent progress on joining …

The thickness of the solder, for Cu/Sn/Cu microbumps with dimensions of tens of microns or
even a few microns (such as 40 µm, 15 µm, 10 µm, and 6 µm), can have a significant effect …

Solder materials demonstrate evolving microstructure and mechanical behavior that
changes significantly with environmental exposures such as isothermal aging and thermal …

The microstructure, mechanical response, and failure behavior of lead free solder joints in
electronic assemblies are constantly evolving when exposed to isothermal aging and/or …

In order to obtain a better understanding of the phase stabilities and mechanical behaviors
of Cu 3 Sn compounds, we performed first-principles calculations to predict the structural …

The effects of aging on mechanical behavior of lead free solders have been examined by
performing creep tests on four different SAC alloys (SAC105, SAC205, SAC305, SAC405) …

In general, formation and growth of intermetallic compounds (IMCs) play a major role in the
reliability of the solder joint in electronics packaging and assembly. The formation of Cu-Sn …

The mechanical properties of a lead free solder are strongly influenced by its microstructure,
which is controlled by its thermal history including solidification rate and thermal aging after …

In this work, the phase stability, elasticity, fracture toughness, electronic characteristics and
thermal conductivity of Ag-doped η′-Cu 6 Sn 5 were explored based on the first-principles …