JH Lau, CT Ko, CY Peng, KM Yang… - Journal of …, 2020 - meridian.allenpress.com
In this investigation, the chip-last, redistribution-layer (RDL)–first, fan-out panel-level packaging (FOPLP) for heterogeneous integration is studied. Emphasis is placed on the …
Abstract System-in-package (SiP) technology has been used extensively on consumer products such as smartwatches, smartphones, tablets, notebooks, TWS (true wireless …
E Lee, VCK Chekuri… - IEEE Transactions on …, 2022 - ieeexplore.ieee.org
This article presents a low-overhead energy harvesting and delivery system (EHDS) with pulse frequency modulated (PFM) integrated voltage regulator (IVR) power conversion and …