Wire bonding using copper or insulated wire leads to many advantages and new
challenges. Research is intensively performed worldwide, leading to many new findings and …

Thermosonic ball bonding is a metallurgical process that until recently was rarely the subject
of metallurgical analysis. However, in recent years greater focus has been given to the …

Abstract “Heterogeneous Integration” is a promising approach for high‐performance hybrid
flexible electronics that combine printed electronics and silicon technology. Despite …

Chapter 1 gives an introduction to Cu wire bonding technology. The advantages of Cu over
Au, such as lower cost, higher mechanical strength, and higher electrical and thermal …

Copper wire bonding has been studied for more than two decades. While copper wire
bonding has many advantages over gold wire bonding, many challenges have to be solved …

Copper wire bonding of microelectronic parts has developed as a means to cut the costs of
using the more mature technology of gold wire bonding. However, with this new technology …

Thermosonic ball bonding is a major interconnect process in microelectronics packaging
and is positioned to remain one of the key process technologies available to package …

Heterogeneous integration on flexible substrates has been explored in recent years to meet
the high‐performance and flexible form factors requirements of several emerging …

Gold wire bonding has been widely used as the first-level interconnect in semiconductor
packaging. The increase in the gold price has motivated the industry search for an …

Given the cost and performance advantages associated with Cu wire, it is being increasingly
seen as a candidate to replace Au wire for making interconnections in first level …