During soldering and service, intermetallic compounds (IMCs) have an important impact on
the performance and reliability of electronic products. A thin and continuous intermetallic …

During the past decades, series of lead-free solders have been developed rapidly, and are
considered as the attractive interconnection materials replacing traditional Sn-Pb solders in …

The composition of alloying elements in Sn-rich solder plays a pivotal role in determining the
performance of solder joints in an electronic package. Recently, Indium (In) has attracted …

This paper elucidated the effects of the Bi element (0 wt%, 0.5 wt% and 1.5 wt%) on the
microstructure, electrical, wettability and mechanical properties of the Sn-0.7 Cu-0.05 Ni as a …

In this study, the Ag and In were alloyed to the Sn-58Bi solder, and their individual and
combined influences on the SnBi solder and the SnBi/Cu solder joints were investigated …

The work described in this paper forms part of a study on the mechanochemical processing
of Al with dissimilar metals for hydrogen generation purposes. Here, in an effort to contain …

Nanocomposite lead-free solders are gaining prominence as replacements for conventional
lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are …

The restriction of using toxic and harmful Sn-Pb solders has led to the rapid development of
lead-free solders in recent decades. This research on the effect of indium (In) microalloying …

Abstract Bi-containing Sn0. 7Cu (SC) eutectic solder alloys were prepared and subjected to
directional solidification, through which new types of fiber reinforced eutectic composites …

Nowadays, a major concern of Sn–Cu based solder alloys is focused on continuously
improving the comprehensive properties of solder joints formed between the solders and …