This book presents a comprehensive review, evaluation, and summary of the dependence of
mechanical properties on grain and particle parameters of monolithic ceramics and ceramic …

Metallic copper, which has low electrical resistivity and high thermal conductivity, is widely
used as an interconnector or substrate within microelectronic packages. If a small amount of …

The adhesion at interfaces between dissimilar materials is strongly affected by both
segregation and the extent of plasticity in the adjoining material, particularly when one of …

The transition behavior of an Al-rich amorphous oxide layer to an external Al 2 O 3 layer on
Fe–(4, 24) Cr–(6, 10) Al (at.%) alloys was investigated during heating to 1000° C at a …

We propose an atomistic model to describe the copper/sapphire interface by means of
simple interatomic potentials involving only a few fitting parameters. Successful results are …

The influence of oxygen on the wetting behavior of copper on single‐crystal Al2O3 has been
studied. By controlling the oxygen partial pressure (pO2) and oxygen content in the copper …

The influence of orientation and impurities on the fracture behavior of Nb–sapphire
interfaces was studied using notched bending tests. Single crystals were diffusion bonded in …

Alumina has been joined at 1150° C and 1400° C using multilayer copper/niobium/copper
interlayers. Four-point bend strengths are sensitive to processing temperature, bonding …

Surface metallization of aluminum nitride is performed by a reactively thick film method. A
layer of copper film is deposited on the surface of AlN ceramics. The morphology and …

This work investigates the effect of continuous CuAlO2 interfacial reaction product layers on
the strength of eutectic bonded copper–alumina interfaces. The fracture resistance was …