As one of the promising packaging materials, the paste of silver nanoparticles (AgNPs)
reinforced by SiC particles is investigated in this study for microstructure, thermal stability …

A one-step polyol method was employed to synthesize bimodal Cu particles with average
diameters around 200 nm and 1000 nm, respectively. The bimodal Cu particles were mixed …

This paper explores the possibility of using Ag paste containing silicon carbide particles (SiC-
p) as a novel high-temperature die-attachment solution for the design of power devices. The …

Cu@ Ag core-shell material not only has advantages of Cu and Ag elements but also
inhibits Ag migration and Cu oxidation issues, showing potential in die attachments for …

Based on molecular dynamics (MD), in this study, a model was established to simulate the
initial coating morphology of silver paste by using a random algorithm, and the effects of …

We have developed a new kind of nanosilver paste by reducing the stress and strain of the
drying process with the help of some organics to bond large-area (≥ 100 mm 2) power …

Advances in Manufacturing and Processing of Materials and Structures cover the latest
advances in materials and structures in manufacturing and processing including additive …

Purpose This paper aims to find proper technological parameters of low-temperature joining
technique by silver sintering to eventually use this technique for reliable electronic …

For harsh service conditions, sintered silver nanoparticles (AgNP) own the most appealing
advantage of low temperature sintering and high temperature service. More importantly …

Silver paste, as a novel thermal interface material, has wide applications in elevated
temperature power electronics. In practice, usually pressure higher than 5 MPa is necessary …