Overview of real-time lifetime prediction and extension for SiC power converters

Z Ni, X Lyu, OP Yadav, BN Singh… - IEEE Transactions on …, 2019 - ieeexplore.ieee.org
Remaining useful lifetime prediction and extension of Si power devices have been studied
extensively. Silicon carbide (SiC) power devices have been developed and commercialized …

High-temperature encapsulation materials for power modules: Technology and future development trends

H Gao, P Liu - IEEE transactions on components, packaging …, 2022 - ieeexplore.ieee.org
The applications of wide bandgap (WBG) semiconductors represented by silicon carbide
(SiC) and gallium nitride (GaN) in power modules are currently limited by the thermal …

Single-crystalline SiC integrated onto Si-based substrates via plasma-activated direct bonding

Q Kang, C Wang, F Niu, S Zhou, J Xu, Y Tian - Ceramics International, 2020 - Elsevier
We propose a plasma-activated direct bonding process at low temperatures (≤ 200° C) to
form heterostructures between single-crystalline SiC and conventional Si-based substrates …

Review of SiC MOSFET Failure Analysis Under Extreme Conditions: High Temperature, High Frequency and Irradiation

Z Zhang, L Liang, H Shang - … of 2021 International Joint Conference on …, 2022 - Springer
With the inherent advantages of material, SiC MOSFET is promising in many applications.
There is much research on failure analysis of SiC MOSFET under extreme conditions. A …

Bismaleimide/epoxy/aromatic diamine ternary resin molding compounds for high-temperature electronic packaging applications

F Zhu, Y Bao, W Hu, Z Li, X Fei, J Liu, X Li… - Journal of Materials …, 2025 - Springer
Abstract Development of the high-power devices based on the third-generation
semiconductor puts forward a high requirement for the thermal performance of electronic …

Multiphysics condition monitoring technique for reliability assessment of wide bandgap-based power modules in electric vehicle application

J Naghibi, K Mehran - 2020 Fifteenth International Conference …, 2020 - ieeexplore.ieee.org
Comprehensive and accurate reliability assessment can address the existing design
challenges in using wide bandgap-based semiconductor technology in new power …

Wide Band-Gap Semiconductor Based Power Converter Reliability and Topology Investigation

Z Ni - 2020 - search.proquest.com
Wide band-gap semiconductor materials such as silicon carbide (SiC) and gallium nitride
(GaN) have been widely investigated these years for their preferred operation at higher …

Effet du vieillissement par fatigue électrothermique sur la compatibilité électromagnétique des composants de puissance à base de SiC

C Douzi - 2019 - theses.hal.science
Ce travail de recherche porte sur l'étude de l'effet du vieillissement par fatigue
électrothermique sur la compatibilité électromagnétique des composants de puissance à …