Fuzzy logic Taguchi method (FLTM) is used to optimize parameters for wire bonding
process. The proposed FLTM integrates orthogonal arrays, signal-to-noise ratios, response …

This paper provides an overview of recent achievements on 3D thermal management
obtained at CEA-Leti and STMicroelectronics. We present new insights into thermal …

As the interconnected structure of 3D chip, through. silicon via undertakes the key functions
in energy transmission, mechanical support and signal transmission of 3D chip. With the …

This chapter first introduces different modeling techniques with varying flexibility and
complexity to be used at different stages of the design flow, ranging from fast‐solving …

Amongst the cooling solutions proposed to mitigate heat hazard effects in microelectronics,
heat spreaders seem to be one of the most suitable when thickness and space constraints …

A cooling system composed of a thermal redistribution layer (TRDL) and a thermal through‐
silicon via (TTSV) is proposed for three‐dimensional integrated circuits (3D ICs). According …

As the short vertical interconnections can significantly shorten the interconnect length
between different circuits, three‐dimensional integrated circuits (3D ICs) based on the …

We present an advanced and comprehensive platform for thermal dissipation studies in TSV-
based 3D ICs. A 2-tier 3D test chip with through silicon via (TSV) and μ-bump is used for …

The work develops an analytical thermal model for a thermal Through Silicon Vias based
heat mitigation power chip whose thermal path is quite different compared to the literatures …

Heat generation in integrated circuits has become in few decades one of the most limiting
factors for performance improvement in mobile device components, such as cell phones or …