Recent advances and trends in Cu–Cu hybrid bonding
JH Lau - IEEE Transactions on Components, Packaging and …, 2023 - ieeexplore.ieee.org
In this study, the recent advances and trends in Cu–Cu hybrid bonding will be investigated.
Emphasis is placed on the definition, kinds, advantages and disadvantages, challenges …
Emphasis is placed on the definition, kinds, advantages and disadvantages, challenges …
[图书][B] Chiplet design and heterogeneous integration packaging
JH Lau - 2023 - Springer
There are at least five different chiplet design and heterogeneous integration packaging,
namely (1) chip partition and heterogeneous integration (driven by cost and technology …
namely (1) chip partition and heterogeneous integration (driven by cost and technology …
Chip-last (RDL-first) fan-out panel-level packaging (FOPLP) for heterogeneous integration
JH Lau, CT Ko, CY Peng, KM Yang… - Journal of …, 2020 - meridian.allenpress.com
In this investigation, the chip-last, redistribution-layer (RDL)–first, fan-out panel-level
packaging (FOPLP) for heterogeneous integration is studied. Emphasis is placed on the …
packaging (FOPLP) for heterogeneous integration is studied. Emphasis is placed on the …
Quantification of wafer bond strength under controlled atmospheres
K Takeuchi, T Suga - Japanese Journal of Applied Physics, 2022 - iopscience.iop.org
Bond strength is the most reliable criterion of the wafer bonding quality. Water stress
corrosion affects the bond strength, corresponding to the measurement atmosphere and …
corrosion affects the bond strength, corresponding to the measurement atmosphere and …
State-of-the-art and outlooks of chiplets heterogeneous integration and hybrid bonding
JH Lau - Journal of Microelectronics and Electronic …, 2021 - meridian.allenpress.com
In this study, the recent advances and trends of chip-let design and heterogeneous
integration packaging will be investigated. Emphasis is placed on the definition, kinds …
integration packaging will be investigated. Emphasis is placed on the definition, kinds …
Glass-to-glass fusion bonding quality and strength evaluation with time, applied force, and heat
A bonding process was developed for glass-to-glass fusion bonding using Borofloat 33
wafers, resulting in high bonding yield and high flexural strength. The Borofloat 33 wafers …
wafers, resulting in high bonding yield and high flexural strength. The Borofloat 33 wafers …
Cu-Cu Hybrid Bonding
JH Lau - Chiplet Design and Heterogeneous Integration …, 2023 - Springer
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