A review of interconnect materials used in emerging memory device packaging: First-and second-level interconnect materials
YS Zou, CL Gan, MH Chung, H Takiar - Journal of Materials Science …, 2021 - Springer
The main motivation of this review is to study the evolution of first and second level of
interconnect materials used in memory device semiconductor packaging. Evolutions of …
interconnect materials used in memory device semiconductor packaging. Evolutions of …
Wettability and interfacial reactions of Sn–Ag–Cu/Cu and Sn–Ag–Ni/Cu solder joints
The effects of Cu and Ni additions on the wettability and interfacial reaction of Sn–Ag solder
with Cu substrate were investigated. The wettability of the Sn–3.0 Ag–0.5 Cu (or Ni) solder …
with Cu substrate were investigated. The wettability of the Sn–3.0 Ag–0.5 Cu (or Ni) solder …
Cu–Sn and Ni–Sn transient liquid phase bonding for die-attach technology applications in high-temperature power electronics packaging
BS Lee, SK Hyun, JW Yoon - Journal of Materials Science: Materials in …, 2017 - Springer
Power electronics modules in electric vehicles and hybrid electric vehicles, particularly those
containing next-generation power semiconductor devices such as silicon carbide and …
containing next-generation power semiconductor devices such as silicon carbide and …
IMC morphology, interfacial reaction and joint reliability of Pb-free Sn–Ag–Cu solder on electrolytic Ni BGA substrate
The interfacial reaction, morphology of intermetallic compound (IMC) and shear strength
between the Sn–3.5 Ag–0.7 Cu (in wt.%) solder and Ni ball grid array (BGA) substrates …
between the Sn–3.5 Ag–0.7 Cu (in wt.%) solder and Ni ball grid array (BGA) substrates …
Interfacial reaction and mechanical properties of eutectic Sn–0.7 Cu/Ni BGA solder joints during isothermal long-term aging
The interfacial reactions and growth kinetics of intermetallic compound (IMC) layers formed
between Sn–0.7 Cu (wt.%) solder and Au/Ni/Cu substrate were investigated at aging …
between Sn–0.7 Cu (wt.%) solder and Au/Ni/Cu substrate were investigated at aging …
Effects of indium addition on properties and wettability of Sn–0.7 Cu–0.2 Ni lead-free solders
LF Li, YK Cheng, GL Xu, EZ Wang, ZH Zhang… - Materials & Design, 2014 - Elsevier
This paper reports the investigation on indium addition into Sn–0.7 Cu–0.2 Ni lead-free
solder to improve its various performances. The effects of indium addition on melting …
solder to improve its various performances. The effects of indium addition on melting …
Reliability investigation and interfacial reaction of ball-grid-array packages using the lead-free Sn-Cu solder
JW Yoon, SW Kim, JM Koo, DG Kim… - Journal of Electronic …, 2004 - Springer
The interfacial reactions between two Sn-Cu (Sn-0.7 Cu and Sn-3Cu, wt.%) ball-grid-array
(BGA) solders and the Au/Ni/Cu substrate by solid-state isothermal aging were examined at …
(BGA) solders and the Au/Ni/Cu substrate by solid-state isothermal aging were examined at …
Investigating the effect of isothermal aging on the morphology and shear strength of Sn-5Sb solder reinforced with carbon nanotubes
An analysis of the role played by the addition of carbon nanotubes (CNTs) to the solder
matrix of conventional Sn-5Sb lead-free solder was performed. In a bid to determine the …
matrix of conventional Sn-5Sb lead-free solder was performed. In a bid to determine the …
Interfacial reactions between Sn–0.4 Cu solder and Cu substrate with or without ENIG plating layer during reflow reaction
The interfacial reaction and morphology change of intermetallic compound (IMC) between
the Sn–0.4 wt.% Cu solder and two different kinds of substrates (Cu and electroless nickel …
the Sn–0.4 wt.% Cu solder and two different kinds of substrates (Cu and electroless nickel …
Solder joint quality evaluation based on heating factor
Purpose The purpose of this paper is to increase the reliability of manufactured electronics
and to reveal reliability significant factors. The experiments were focused especially on the …
and to reveal reliability significant factors. The experiments were focused especially on the …