An embedded component device includes an electronic component including an electrical
contact, an upper patterned conductive layer, a dielectric layer between the upper patterned …

(57) ABSTRACT A semiconductor package includes at least one semiconduc tor die having
an active Surface, an interposer element having an upper Surface and a lower Surface, a …

A chip package structure and a method of manufacturing the same are provided. The chip
package structure includes a package portion and a plurality of external conductors. The …

Int. Cl.(57) HOIL 23/248(2006.01) A wafer level fan out package includes a semiconductor
die HOIL 23/28(2006.01) having a first Surface, a second Surface, and a third Surface. A …

Packaging methods and packaged devices are disclosed. In one embodiment, a method of
packaging a semiconductor device includes forming a first redistribution layer (RDL) over a …

The present invention is directed to a process of fabricating an embedded chip package
structure. 0008. The present invention is further directed to a chip package structure in which …

A wafer level chip size package (WLCSP) and a method of manufacturing the same are
disclosed. Lands are formed at the ends of redistribution layers. The redistribution layers …

(57) ABSTRACT A wafer level fan out package includes a semiconductor die having a first
Surface, a second Surface, and a third Surface. A stiffener is disposed on the third surface of …

Embodiments of the present invention provide an integrated circuit system including a first
active layer fabricated on a front side of a semiconductor die and a second pre-fabricated …

A semiconductor package includes a substrate unit, a die electrically connected to first
contact pads, and a package body covering a first patterned conductive layer and the die …