Conspectus Gold (Au), a transition metal with an atomic number of 79 in the periodic table of
elements, was discovered in approximately 3000 BC Due to the ultrahigh chemical stability …

Due to the advantages of small form factor, high performance, low power consumption, and
high density integration, three-dimensional integrated circuits (3D ICs) have been generally …

Due to the demand for high-performance electronic products, there has been a rapid
development in three-dimensional integrated circuit (3D IC) packaging technology. The 3D …

This paper reports the extreme sensitivity of the microstructure evolution in Sn-Ag-Cu (SAC)
micro-solder joint, consisting of 15–20 µm thick solder alloy and electrolytic Ni plated Cu …

Ni barrier symmetry effect on the electromigration (EM) failure mechanism of Cu/Sn–Ag
microbump were systematically investigated by studying the intermetallic compound (IMC) …

The mean-time-to-failure (MTTF) associated with microbumps is a pivotal factor influencing
the reliability of cutting-edge consumer electronic devices. Within Sn-based solder joints, the …

In this article, the 3D integration with Ni/Sn/Ni joints was conducted using transient liquid
phase (TLP) bonding (250° C, 0.2 N) with different bonding time. After TLP bonding, plane …

The feasibility of novel ultrathin-Electroless Ni/Electroless Pd/Immersion Au (ultrathin-
ENEPIG) metallization containing ultrathin electroless Ni layer for 3D-IC packaging …

Effects of solder volume on the electromigration (EM) failure mechanism of Cu/Ni/Sn-2.5 Ag
microbumps were systematically investigated at 150° C with a current density of 1.5× 10 5 …

Electronic packaging products are often subjected to reliability evaluation, Sn–Pb solder is
widely used in high-reliability military products due to its excellent soldering performance …