Effective surface treatments suppress possible recombination losses and confine
photogenerated electrons and holes within the bulk of the silicon wafer, thus maximizing …

Poor contact adhesion is one of the major concerns in the low cost Ni-Cu front contact
metallization for c-Si solar cells. It reduces the mechanical as well as electrical reliability of …

Oxidation-resistant electrically-conductive metal particles (ORCMP) are disclosed. ORCMPs
are comprised of a base-metal core, an oxidation-resistant first shell, and an optional …

With the development of photovoltaic industry, the cost of photovoltaic power generation has
become the significant issue. And the metallization process has decided the cost of original …

3,930,093 3,949,118 4,001,146 4,045,245 4,122,232 4,130,854 4,137.361 4,347,165
4,397,812 4.485, 153 4,492.812 4,635,701 4,800,065 4,833,040 4,873,148 5,118,362 …

US9741878B2 - Solar cells and modules with fired multilayer stacks - Google Patents
US9741878B2 - Solar cells and modules with fired multilayer stacks - Google Patents Solar cells …

(57) ABSTRACT A method of forming a fired multilayer stack are described. The method
involves the steps of a) applying a wet metal particle layer on at least a portion of a surface …

Metallization pastes for use with semiconductor devices are disclosed. The pastes contain
silver particles, low-melting-point base-metal particles, organic vehicle, and optional …

Intercalation pastes for use with semiconductor devices are disclosed. The pastes contain
precious metal particles, inter calating particles, and an organic vehicle and can be used to …

Intercalation pastes for use with semiconductor devices are disclosed. The pastes contain
precious metal particles, inter calating particles, and an organic vehicle and can be used to …