Heat dissipation in electronic devices is challenging due its limited size and cooling space constraint. Implementing Triply Periodic Minimal Surfaces (TPMS)-based cellular structures …
Improving the thermal performance of cooling systems is crucial for energy and raw material savings, increasing the thermal ratings, and extending the work life of various equipment …
In the present work, a new fin shape is proposed to improve the convective heat transfer in heat sinks and to reduce their weight. The problem under consideration is a natural …
The increase in module operating temperature above 25° C can be detrimental to the electrical output performance of photovoltaic (PV) modules. The study introduces a novel …
The two-phase investigation of a silver–water nanofluid flow within the elliptical pin-fin heat sink regarding different nanoparticle volume fractions, fin densities, and Reynolds numbers …
M Muneeshwaran, MK Tsai, CC Wang - International Communications in …, 2023 - Elsevier
A novel notched fin heat sink with a central opening is proposed in the present study to augment the heat transfer performance of the natural convection heat sink under horizontal …
This research deals with an experimental investigation to manage the thermo-hydraulic performance of the heat sink with pin fin array under forced convection at various design …
Efficient cooling of the electronic device is of paramount importance for its safe and reliable operation. Therefore, the present study makes a performance analysis of branched and …
Y Ge, Q He, Y Lin, W Yuan, J Chen… - Applied Thermal …, 2022 - Elsevier
Micro/mini-channel heat sinks (MCHS) have been extensively employed for heat dissipation under high heat flux conditions, and their performances are crucial for safe and stable …