With the rising challenges in heat removal in integrated circuits (ICs), the development of
thermal-aware computing architectures and run-time management systems has become …

With the increase in transistor density in state-of-the-art circuits the power behavior of
integrated circuits changes drastically, which may result in device failures. This may become …

Dominance of on-chip power densities has become a critical design constraint in high-
performance VLSI design. This is primarily due to increased technology scaling, number of …

Minimization of power dissipation of VLSI circuits is one of the major concerns of recent
digital circuit design primarily due to the ever decreasing feature sizes of circuits, higher …

Minimization of power dissipation of VLSI circuits is one of the major concerns of recent
digital circuit design primarily due to the ever decreasing feature sizes of circuits, higher …

In DSM (deep sub-micron) regime, together with the integration density interconnects play a
dominant role during layout design of integrated circuits. It eventually increases the …

During recent days, the large problem space of very large scale integrated (VLSI) circuits
has led global routing problem to a NP Complete one. With the advent of three dimensional …

Thermal effects are rapidly gaining importance in nanometer CMOS technologies. Increased
power density, coupled with spatio-temporal variability of chip workloads, causes on-die …

In high-performance VLSI circuits, the on-chip power densities are playing dominant role in
both static and dynamic conditions due to increased scaling of technology, increasing …

The high integration density interconnects, closerproximity of modules, and the routing
phase are pivotal during the layout of 3D ICs. Heuristic based approaches are typically used …