Composite lead-free solders, containing micro and nano particles, have been widely
studied. Due to grain boundary drag or Zener drag, these particles can refrain the solder …

During soldering and service, intermetallic compounds (IMCs) have an important impact on
the performance and reliability of electronic products. A thin and continuous intermetallic …

Solid-liquid interdiffusion (SLID) bonding was extensively investigated as a potential
bonding method applied to 3D chip stacking because it can be bonded at a low temperature …

During the past decades, series of lead-free solders have been developed rapidly, and are
considered as the attractive interconnection materials replacing traditional Sn-Pb solders in …

SnAgCu solder alloys were considered as one of the most popular lead‐free solders
because of its good reliability and mechanical properties. However, there are also many …

This study investigated the effects of adding 0.5 wt.% nano-TiO2 particles into Sn3. 5Ag0.
5Cu (SAC) lead-free solder alloys on the growth of intermetallic compounds (IMC) with Cu …

With the development of microelectronic packaging and increasingly specific service
environment of solder joints, much stricter requirements have been placed on the properties …

Incorporating various types of ceramic type nanoparticles into Pb-free solder pastes
produces unique nanocomposite solder pastes. In this study, Sn–Ag–Cu (SAC) 305 solder …

For development of lead-free solder for advance electrical components, the correlation of
microstructure with thermal and creep properties of novel Ni-doped Sn–0.5 Ag–0.7 Cu (SAC …

Nanocomposite lead-free solders are gaining prominence as replacements for conventional
lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are …