A growing need exists for efficient and accurate methods for detecting defects in
semiconductor materials and devices. These defects can have a detrimental impact on the …

Fast yield learning is critical to bringing products to the market in a timely fashion and is
strongly linked to product revenues. This paper reviews methods to enable efficient yield …

The enormous progress in integrated circuit manufacturing over the last 30 years would
have been impossible without the science of yield enhancement and defect reduction. This …

In this review, automatic defect inspection algorithms that analyze Electron Microscope (EM)
images of Semiconductor Manufacturing (SM) products are identified, categorized, and …

Manufacturing of semiconductor devices is an extremely complicated, time consuming, multi-
stage process. In order to maintain acceptable yield levels, the production line must be …

In this paper we present a methodology for enhanced automatic defect classification (ADC)
of defects optically detected during post fab inspection and present results from production …

SEM review is increasingly being utilized for defect analysis and classification. Root cause
analysis typically required both detailed defect imaging and elemental analysis. The use of …

A methodology is described where wafers with specialized test structures are inspected with
wafer metrology tools to assist process development for Cu BEOL fabrication. A Cu …

本論文實現了一套結合缺陷偵測與分類的自動化缺陷分類系統. 缺陷偵測的部分,
我們必須先利用MAD 的方法將待測影像與參考影像對齊, 其中參考影像為不包含缺陷的影像 …

As the industry moves to smaller design rules, shrinking process windows and shorter
product lifecycles, the need for enhanced yield management methodology is increasing …