Explicit submodeling and digital image correlation based life-prediction of leadfree electronics under shock-impact
P Lall, S Shantaram, A Angral… - 2009 59th Electronic …, 2009 - ieeexplore.ieee.org
Relative damage-index based on the leadfree interconnect transient strain history from
digital image correlation, explicit finite-elements, cohesive-zone elements, and component's …
digital image correlation, explicit finite-elements, cohesive-zone elements, and component's …
Peridynamic-models using finite elements for shock and vibration reliability of leadfree electronics
P Lall, S Shantaram… - 2010 12th IEEE …, 2010 - ieeexplore.ieee.org
Electronic packages subjected to drop and shock have been simulated using alternative
theory known as peridynamic theory in the realm of FEM. In peridynamics, problems are …
theory known as peridynamic theory in the realm of FEM. In peridynamics, problems are …
Mechanical deformation behavior of SAC305 at high strain rates
Electronic products are subjected to high G-levels during mechanical shock and vibration.
Failure-modes include solder-joint failures, pad cratering, chip-cracking, copper trace …
Failure-modes include solder-joint failures, pad cratering, chip-cracking, copper trace …
Modeling and reliability characterization of area-array electronics subjected to high-g mechanical shock up to 50,000 g
Electronics in aerospace applications may be subjected to very high g-loads during normal
operation. A novel micro-coil array interconnect has been studied for increased reliability …
operation. A novel micro-coil array interconnect has been studied for increased reliability …
Stress–strain behavior of SAC305 at high strain rates
Electronic products are subjected to high G-levels during mechanical shock and vibration.
Failure-modes include solder-joint failures, pad cratering, chip-cracking, copper trace …
Failure-modes include solder-joint failures, pad cratering, chip-cracking, copper trace …
Constitutive Behavior of SAC Leadfree Alloys at High Strain Rates
Electronic products are subjected to high G-levels during mechanical shock and vibration.
Failure-modes include solder-joint failures, pad cratering, chip-cracking, copper trace …
Failure-modes include solder-joint failures, pad cratering, chip-cracking, copper trace …
Model for inverse determination of process and material parameters for control of Package-on-Package warpage
P Lall, K Patel, V Narayan - IEEE Transactions on Components …, 2015 - ieeexplore.ieee.org
Package-on-package (PoP) assemblies may experience warpage during package
fabrication and later during surface mount assembly. Excessive warpage may result in loss …
fabrication and later during surface mount assembly. Excessive warpage may result in loss …
Model for prediction of package-on-package warpage and the effect of process and material parameters
P Lall, K Patel, V Narayan - 2013 IEEE 63rd Electronic …, 2013 - ieeexplore.ieee.org
Package-on-Package (PoP) assemblies may experience warpage during package
fabrication and later during surface mount assembly. Excessive warpage may result in loss …
fabrication and later during surface mount assembly. Excessive warpage may result in loss …
High strain-rate mechanical properties of SnAgCu leadfree alloys
Electronic products are subjected to high G-levels during mechanical shock and vibration.
Failure-modes include solder-joint failures, pad cratering, chip-cracking, copper trace …
Failure-modes include solder-joint failures, pad cratering, chip-cracking, copper trace …
High-G shock reliability of ceramic area-array packages
Electronics in aerospace applications may be subjected to very high g-levels during normal
operation. A column array interconnect has been studied for reliability during extended …
operation. A column array interconnect has been studied for reliability during extended …