The article provides a review of the state-of-art non-destructive testing (NDT) methods used
for evaluation of integrated circuit (IC) packaging. The review identifies various types of the …

This review investigates the measurement methods employed to assess the geometry and
electrical properties of through-silicon vias (TSVs) and examines the reliability issues …

Terahertz radiation for inspection and fault detection has been of interest for the
semiconductor industry since the first generation and detection of THz signals. Until recent …

Integrated circuit plays an important role in the information technology industry. Surface
defect inspection of IC packages is an essential process in the IC packaging manufacturing …

Through-silicon vias (TSVs) are a critical technology for three-dimensional integrated circuit
technology. These through-substrate interconnects allow electronic devices to be stacked …

Continuous scaling of package architectures requires small volume and high-density
microbumps in 3D stacking, which often result in solders fully transforming to intermetallic …

The thermomechanical properties of microelectronic packages can serve as important
indicators of reliability. Indeed, it is of great interest in dynamic warpage measurement of …

The reliability of Cu bonding technology in three-dimensional integration packaging is
limited by high sintering temperatures and the growth of oxide at the joining interface …

Metal packaging is an alternative technology to guarantee the environmental resistance and
the performance reliability of ICs. Surface defect inspection of IC metal packages is an …

This paper deals with a new induction motor defects diagnosis using the Axial Vibration
Analytical Signal (AVAS). The signal is generated by a bearing-defected induction machine …