Hybrid dicing process using a blade and laser
P Kumar, WS Lei, J Papanu, B Eaton… - US Patent 9,130,057, 2015 - Google Patents
A method and system of hybrid dicing using a blade and laser are described. In one
embodiment, a method involves focusing a laser beam inside the substrate in regions …
embodiment, a method involves focusing a laser beam inside the substrate in regions …
Hybrid laser and plasma etch wafer dicing using substrate carrier
S Singh, B Eaton, A Kumar, WS Lei, JM Holden… - US Patent …, 2014 - Google Patents
11, 2003 1, 2004 2, 2004 3, 2004 T/2004 10, 2004 5/2005 2, 2006 10, 2006 10, 2006 2,
2007 9, 2007 4, 2008 10, 2008 12, 2008 12, 2008 1/2009 3, 2009 12, 2009 3, 2010 3, 2010 …
2007 9, 2007 4, 2008 10, 2008 12, 2008 12, 2008 1/2009 3, 2009 12, 2009 3, 2010 3, 2010 …
Damage isolation by shaped beam delivery in laser scribing process
JM Holden, N Merry, T Egan - US Patent 9,029,242, 2015 - Google Patents
Methods and apparatuses for dicing substrates by both laser scribing and plasma etching. A
method includes laserablating material layers, the ablating by a laser beam with a centrally …
method includes laserablating material layers, the ablating by a laser beam with a centrally …
Wafer dicing from wafer backside and front side
WS Lei, B Eaton, A Kumar - US Patent 9,224,650, 2015 - Google Patents
BACKGROUND 1) Field Embodiments of the present invention pertainto the field of
semiconductor processing and, in particular, to methods of dicing semiconductor wafers …
semiconductor processing and, in particular, to methods of dicing semiconductor wafers …
Method of die singulation using laser ablation and induction of internal defects with a laser
JS Papanu, WS Lei, J Park, A Lerner, B Eaton… - US Patent …, 2015 - Google Patents
Zafman LLP (57) ABSTRACT A method and system of hybrid laser dicing are described. In
one embodiment, a method includes focusing a laser beam inside a Substrate in regions …
one embodiment, a method includes focusing a laser beam inside a Substrate in regions …
Laser-dominated laser scribing and plasma etch hybrid wafer dicing
WS Lei, JS Papanu, B Eaton, A Kumar - US Patent 8,975,163, 2015 - Google Patents
BACKGROUND 1) Field Embodiments of the present invention pertainto the field of
semiconductor processing and, in particular, to methods of dicing semiconductor wafers …
semiconductor processing and, in particular, to methods of dicing semiconductor wafers …
Water soluble mask for substrate dicing by laser and plasma etch
WS Lei, S Singh, MR Yalamanchili, B Eaton… - US Patent …, 2014 - Google Patents
US PATENT DOCUMENTS Methods of dicing substrates having a plurality of ICs. A
4,049,944 A 9, 1977 Garvin et al. method includes forming a mask comprising a water …
4,049,944 A 9, 1977 Garvin et al. method includes forming a mask comprising a water …
Cooled tape frame lift and low contact shadow ring for plasma heat isolation
AH Ouye - US Patent 9,236,284, 2016 - Google Patents
COLAFRAME OF THE SUBSTRATE CARRIERWITHA described. In an example, a tape
frame lift assembly for a plasma processing chamber includes a capture single ring having …
frame lift assembly for a plasma processing chamber includes a capture single ring having …
Residue removal from singulated die sidewall
WS Lei, P Kumar, JS Papanu, A Kumar… - US Patent …, 2015 - Google Patents
BACKGROUND 1) Field Embodiments of the present invention pertainto the field of
semiconductor processing and, in particular, to methods of dicing semiconductor wafers …
semiconductor processing and, in particular, to methods of dicing semiconductor wafers …
Wafer dicing with etch chamber shield ring for film frame wafer applications
WS Lei, S Singh, J Dinev, A Iyer, B Eaton… - US Patent …, 2016 - Google Patents
Laser and plasma etch wafer dicing where a mask is formed covering ICs formed on the
wafer, as well as any bumps providing an interface to the ICs. The semiconductor wafer is …
wafer, as well as any bumps providing an interface to the ICs. The semiconductor wafer is …