Wafer scale bonded active photonics interposer
D Coolbaugh, D La Tulipe, G Leake - US Patent 10,698,156, 2020 - Google Patents
There is set forth herein a method including building an interposer base structure on a first
wafer having a first substrate, wherein the building an interposer base structure includes …
wafer having a first substrate, wherein the building an interposer base structure includes …
Optoelectronic component
S Meister, H Rhee, C Theiss, S Kupijai - US Patent 10,775,561, 2020 - Google Patents
An optoelectronic component includes a chip having a substrate and at least one optical
waveguide integrated in the chip. The electro-optical component may be monolithically …
waveguide integrated in the chip. The electro-optical component may be monolithically …
Technologies for Heterogeneous Integration-Challenges and chances for fault isolation
C Boit - Microelectronics Reliability, 2017 - Elsevier
The evolution of electronic devices for Integrated Circuits following Moore's law is one of the
fastest industrial development speeds–and still far too slow for the rapid increase of …
fastest industrial development speeds–and still far too slow for the rapid increase of …