Thermal management has been considered as a key issue for high-power electronics.
Thermal interface materials (TIMs) play an extremely important role in the field of thermal …

The current day target for material scientists and researchers is developing a wholesome
material to satisfy the parameters such as durability, manufacturability, low cost, and …

The trend of continuing miniaturisation of microelectronics leads to new thermal
management challenges. A key point in the heat removal process development is to improve …

Packaging electronic devices is a growing challenge as device performance and power
levels escalate. As device feature sizes decrease, ensuring reliable operation becomes a …

Thermal management is becoming a critical technology challenge for modern electronics
with decreasing device size and increasing power density. One key materials innovation is …

We report on the thermal and electrical properties of hybrid epoxy composites with graphene
and boron nitride fillers. The thicknesses, lateral dimensions, and aspect ratios of each filler …

In recent years, miniaturization and integration have become the development trends of
electronic devices. With the power of electronic devices continuing to increase, the amount …

In recent years, the development of personal protective equipment (PPE) for health care
workers (HCWs) attracted enormous attention, especially during the pandemic of COVID-19 …

Thermal interface materials (TIMs) are applied in electronic devices that are involved in heat
generation and raising the temperature. The optimization of TIMs is important in heat …

Composite holds great promise for future materials considering its advantages such as
excellent strength, stiffness, lightweight, and cost-effectiveness. Due to rising environmental …