Laser processing of hard dielectric materials may include cutting a part from a hard dielectric
material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode …

A glass blank is cut out from a glass plate by forming a crack starting portion inside the glass
plate by moving a first laser beam relative to the glass plate such that a focal position of the …

The present application provides a double-beam laser polishing device and a double-beam
laser polishing method for an aluminum alloy, which includes a frame; a rotary workbench …

(57) ABSTRACT A method of manufacturing a window and a window manu factured by the
same are provided. A method of manufac turing a window includes laser cutting a base …

A method for separating a solid-body layer from a donor substrate includes providing a
donor substrate having a planar surface, a longitudinal axis orthogonal to the planar surface …

A multiple wavelength laser processing system is configured with a multiple wavelength
laser source for generating a multiple wavelength coaxial laser processing beam. The laser …

(57) ABSTRACT A method of cleaving an optical fiber comprises inserting the optical fiber
through a bore of a holding member, securing the optical fiber to the holding member with a …

A double fibre laser cutting system for laser cutting sheet metal that comprises: a cutting
machine with a mobile gantry and fixed metal sheets, multiple heads both for straight cutting …

US20190039941A1 - Shaping a glass substrate after cutting - Google Patents
US20190039941A1 - Shaping a glass substrate after cutting - Google Patents Shaping a …