Interconnects plays an important role in integrated circuits. Copper is used as an
interconnect material, but beyond 22 nm technology node it faces many problems due to …

Reductions in feature size and function integration require either replacement or
modification of existing interconnect materials to fit ever advancing technology. Due to their …

The emerging VLSI technology and simultaneously highly dense packaging of devices and
interconnects in nano-scale chips have prosperously enabled realization of system-on-chip …

The metal–semiconductor (MES)-based through silicon vias (TSV) has provided attractive
solutions over conventional metal–insulator–semiconductor (MIS) TSVs in recent three …

This study explores the potential of randomly mixed carbon nanotube bundle (RMCB) as a
viable on-chip interconnect. Achieving high-quality carbon nanotubes (CNTs) with uniform …

This paper presented a novel stable FDTD algorithm to analyze the crosstalk for coupled
metallic single walled carbon nanotube (SWCNT) interconnect based system. This algorithm …

Modern VLSI devices are manufactured using deep submicron technology. On-chip
interconnects represent a major performance bottleneck for high-speed VLSI architectures …

The state-of-the-art development and subsequent miniaturization of technologies in e-
systems such as computers and digital communication systems have led to densely and …

This paper presents an efficient optimization strategy based on the Stoyan and Yaskov
algorithm to maximize the tube density of randomly distributed mixed carbon nanotube …

This paper introduces the circuit modeling and performance analysis of carbon nanotube-
graphene mixed (CGM) structure interconnects. Based on ABCD method, the transfer …