This paper reviews the fundamentals and latest progress of modeling, analysis, and design
technologies for signal integrity and electromagnetic compatibility on PCB and package in …

Memristive crossbar arrays promise substantial improvements in computing throughput and
power efficiency through in-memory analog computing. Previous machine learning …

As layout density increases in highly integrated multilayer printed circuit boards (PCBs), the
noise that exists in the power distribution network (PDN) is increasingly coupled to the signal …

In this letter, a novel power plane using an inductive S-bridged electromagnetic bandgap
(EBG) is proposed for ultra wideband suppression of the ground bounce noise. The S …

The reliability of circuits on printed circuit boards (PCBs) in many modern electronic products
is affected by severe noise caused by high-speed and low-voltage operation as well as …

Rapid increase in operating frequencies and power density necessitate the importance of
examining electromagnetic compatibility/electromagnetic emissions (EMEs) from high …

In some very low noise mixed-signal circuits, designers may use intentional slots in order to
create a better isolation between a noisy digital ground and a very quiet analog ground …

In this paper, we modeled and analyzed the layer-cutting structure for the mounting pad. We
conduct electrical modeling of the layer-cutting structure for the impedance matching …

Ball-grid array (BGA) packages are widely used in digital signal devices, whose reliability
and signal integrity are critical. In this research, the impact of failed ground solder balls on …

In this paper, a novel meander split power/ground plane is proposed for reducing crosstalk
between parallel lines crossing over it. The working mechanism of the meander split scheme …