Advances in micro and nano-engineered materials for high-value capacitors for miniaturized electronics

R Gupta, A Kumar, A Biswas, R Singh, A Gehlot… - Journal of Energy …, 2022 - Elsevier
High-powered built-on nanostructures are gaining attention for implementing innovative
energy storage technologies with maximum energy storage and burst power. Due to the …

Power delivery for high-performance microprocessors—challenges, solutions, and future trends

K Radhakrishnan, M Swaminathan… - IEEE Transactions …, 2021 - ieeexplore.ieee.org
The power delivery requirements for the early microprocessors were fairly rudimentary due
to the relatively low power levels. However, several decades of exponential scaling powered …

An in-depth understanding of the solvation effect of methanol on the anisotropy of electrochemical corrosion of Ta

J Zhao, Y Xu, X Ding - Electrochimica Acta, 2022 - Elsevier
Although tantalum (Ta) has been studied experimentally for many years as an important anti-
corrosion material, it remains a challenge to accurately predict its corrosion anisotropy …

Stretchable Sensor Materials Applicable to Radiofrequency Coil Design in Magnetic Resonance Imaging: A Review

R Vazquez, E Motovilova, SA Winkler - Sensors, 2024 - mdpi.com
Wearable sensors are rapidly gaining influence in the diagnostics, monitoring, and treatment
of disease, thereby improving patient outcomes. In this review, we aim to explore how these …

Life cycle assessment and environmental profile evaluations of high volumetric efficiency capacitors

L Smith, T Ibn-Mohammed, SCL Koh, IM Reaney - Applied energy, 2018 - Elsevier
High volumetric efficiency capacitors are found in all smart electronic devices, providing
important applications within circuits, including flexible filter options, power storage and …

3-D CMOS chip stacking for security ICs featuring backside buried metal power delivery networks with distributed capacitance

K Monta, H Sonoda, T Okidono, Y Araga… - … on Electron Devices, 2021 - ieeexplore.ieee.org
3-D stacks of complimentary metal-oxide-semiconductor (CMOS) integrated circuit (IC) chips
for security applications monolithically embed backside buried metal (BBM) routing with low …

Heterogeneous power delivery for 7nm high-performance chiplet-based processors using integrated passive device and in-package voltage regulator

A Roth, C Zhou, M Wong, E Soenen… - … IEEE symposium on …, 2020 - ieeexplore.ieee.org
We demonstrate two heterogeneous solutions to improve power delivery to High-
Performance Computing (HPC) processors. The scalable HPC vehicle integrates two 7nm …

System scaling with nanostructured power and RF components

PM Raj, H Sharma, S Sitaraman, D Mishra… - Proceedings of the …, 2017 - ieeexplore.ieee.org
The emergence of smartphones and other smart systems is driving new trends in electronics
scaling that goes beyond transistors or active devices, to include all the system components …

Tungsten-bronze-type BaNd2Ti4O12 ceramics with high permittivity and ultra-low dielectric loss under low frequency

W Guo, C Li, MAU Din, Z Xu, Y Chen, N Cheng - Ceramics International, 2024 - Elsevier
High dielectric constant and ultra-low dielectric loss are important for electronic device
applications of dielectrics. In this work, the novel ceramic BaNd 2 Ti 4 O 12, synthesized via …

Modeling High-Frequency and DC Path of Embedded Discrete Capacitor Connected by Double-Side Terminals with Multi-layered Organic Substrate and RDL-based …

H Lee, K Hwang, H Kwon, J Hwang… - 2022 IEEE 72nd …, 2022 - ieeexplore.ieee.org
Through this work, two-sided model (TSM) for embedded discrete capacitor is presented by
authors. When two sides of the discrete ceramic capacitor embedded in multi-layered …