The surface finish (SF) becomes a part of the solder joint during assembly and improves the
component's reliability. Furthermore, the SF influences the solder joint's reliability by …

Since the restriction of hazardous substances (RoHS) directive, lead-free soldering has
been widely broad adopted. In many applications, lead-free alloys have been substituted for …

Solder joints in electronic assemblies are subjected to mechanical cycling in normal
operating conditions. Testing individual solder joint in mechanical cycling allows monitoring …

During operation, electronic components are exposed to high temperatures that may last for
long periods, depending on the operating duration. Solder joints are one of the components …

The failure of one solder joint out of the hundreds of joints in a system compromises the
reliability of the electronics assembly. Thermal cycling is a result of both creep–fatigue …

The reliability of an electronic assembly is typically limited by the failure of one of the solder
interconnections. One of the key factors that define the quality of solder interconnections is …

Nanocomposite solder has been recognized as an excellent strategy to improve the
reliability of solder joints. This study attempts to find the effects of ZnO nanoparticles (NP) …

The reliability of electronic assemblies is exceedingly reliant on the life of solder joints. Many
factors may influence the fatigue life and mechanical properties of solder joints. Aging is one …

Many electronic products are subjected to heat for long periods, depending on their
operations. Thus, it is expected that the physical and mechanical properties of electronic …

Reliability of the new solder alloys has been a serious concern, especially in the harsh
environment. Aging at elevated temperature alters the structural and mechanical properties …